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IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (850 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4230
Wesentliche Merkmale * Punktlichtquelle mit hohem Wirkungsgrad bei geringer Baugroe * Chipgroe (emittierende Flache) 1 x 1 mm2 * max. Gleichstrom 1 A * niedriger Warmewiderstand (15 K/W) * Emissionswellenlange 850 nm * ESD-sicher bis 2 kV nach JESD22-A114-B Anwendungen * * * * * Infrarotbeleuchtung fur CMOS Kameras Uberwachungssysteme IR-Datenubertragung Fahrer-Assistenz Systeme Maschinensicherheit
Features * Point lightsource with high efficiency and small package * die-size (emitting area) 1 x 1 mm2 * max. DC-current 1 A * Low thermal resistance (15 K/W) * Maximum of spectral emission at 850 nm * ESD save up to 2 kV acc. to JESD22-A114-B Applications * * * * * Infrared Illumination for CMOS cameras Surveillance systems IR Data Transmission Driver assistance systems Machine security
Sicherheitshinweise Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefahrlich fur das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, mussen gema den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Typ Type SFH 4230
1)
Safety Advices Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471.
Bestellnummer Ordering Code Q65110A4023
Gesamtstrahlungsfluss1) (IF = 1A, tp = 100 s) Total Radiant Flux1) e (mW) typ. 440
gemessen mit Ulbrichtkugel / measured with integrating sphere
2007-03-29
1
SFH 4230
Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrschichttemperatur Junction temperature Sperrspannung Reverse voltage Vorwartsgleichstrom Forward current Stostrom, tp < 1 ms, D = 0.2 Surge current Leistungsaufnahme Power consumption Warmewiderstand Sperrschicht - Lotstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 1 A, tp = 10 ms Centroid-Wellenlange der Strahlung Centroid wavelength IF = 1 A, tp = 10 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 1 A, tp = 10 ms Abstrahlwinkel Half angle Aktive Chipflache Active chip area Abmessungen der aktiven Chipflache Dimension of the active chip area
2007-03-29
Symbol Symbol
Wert Value - 40 ... + 100 + 125 1 1 2 2.4 15
Einheit Unit C C V A A W K/W
Top , Tstg TJ VR IF IFSM Ptot RthJS
Symbol Symbol peak
Wert Value 850
Einheit Unit nm
centroid
845
nm
40
nm
60 1 1x1
Grad deg. mm2 mm
A LxB LxW
2
SFH 4230
Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, IF = 1 A, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 1 A, RL = 50 Durchlassspannung Forward voltage IF = 1 A, tp = 100 s Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Temperaturkoeffizient von Ie bzw. e Temperature coefficient of Ie or e IF = 1 A, tp = 10 ms Temperaturkoeffizient von VF Temperature coefficient of VF IF = 1 A, tp = 10 ms Temperaturkoeffizient von Temperature coefficient of IF = 1 A, tp = 10 ms Symbol Symbol Wert Value 10 Einheit Unit ns
tr , tf
VF
1.8 (< 2.4)
V
Ie typ
170
mW/sr
TCI
- 0.5
%/K
TCV
- 0.2
mV/K
TC,centroid
+ 0.2
nm/K
2007-03-29
3
SFH 4230
Gesamtstrahlungsfluss1) e Total Radiant Flux1) e Bezeichnung Parameter Gesamtstrahlungsfluss Total Radiant Flux IF = 1 A, tp = 100 s
1)
Symbol
Werte Values
SFH 4230-CW SFH 4230-DW
Einheit Unit mW mW
e min e max
250 500
400 800
Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one group in one packing unit (variation lower 2:1)
Abstrahlcharakteristik Radiation Characteristics Irel = f ()
40 30 20 10 0
OHL01660
1.0
50
0.8
0.6 60 0.4 70 0.2 80 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 0
2007-03-29
4
SFH 4230
Relative spektrale Emission Relative Spectral Emission Irel = f ()
100 %
OHL01714
Durchlassstrom Forward Current IF = f (VF) Single pulse, tp = 100 s
IF
10 1 A
OHF02843
Relativer Gesamtstrahlungsfluss Relative Total Radiant Flux e/e(1000mA) = f (IF) Single pulse, tp = 100 s
e
101
OHL02830
e (1000 mA)
100
I rel 80
10
0
5
60
10-1
40
10
-1
5
10-2
20
5
0 700
750
800
850
nm 950
10 -2
0
0.5
1
1.5
2
2.5 V 3
10-3 1 10
5 10 2
5 10 3
mA 10 4
VF
IF
Max. zulassiger Durchlassstrom Max. Permissible Forward Current IF = f (TA), RthJS = 15 K/W
1200 mA
OHF02801
Zulassige Impulsbelastbarkeit Permissible Pulse Handling Capability IF = f (tp), TA< 85 C, Duty cycle D = parameter
2.5 IF A 2.0
OHF02803
IF
D=
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1
800
1.5
600
1.0
400
0.5
D = TP
200
t
tP
IF T
0
0
20
40
60
80 C 100
0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102
TS
tp
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5
SFH 4230
Mazeichnung1) Package Outlines
0...0.1 (0.004) A Heat sink Protection Diode R1.5 (0.059) Cathode 1.9 (0.075) C 1.7 (0.067) 1.0 (0.039) 0.8 (0.031) 2.0 (0.079) 1.6 (0.063)
GPLY6192
6.2 (0.244) 5.8 (0.228)
0.8 (0.031) (o4.2 (0.165))
0.29 (0.011) 0.24 (0.009)
11.2 (0.441) 10.8 (0.425) 1.2 (0.047)
7.2 (0.283)
Kathodenkennung: Cathode mark: Gewicht / Approx. weight: Gurtung / Polaritat und Lage Method of Taping / Polarity and Orientation
Markierung mark 0.2 g Verpackungseinheit 800/Rolle, o180 mm Packing unit 800/reel, o180 mm
Cathode/Collector Side
11.5 (0.453)
4 (0.157) 1.55 (0.061) 2 (0.079)
1.75 (0.069)
0.3 (0.012)
12.4 (0.488)
6.35 (0.250) 8 (0.315)
24 (0.945)
1.9 (0.075)
OHAY0508
1)
Mae in mm (inch) / Dimensions in mm (inch) 6
2007-03-29
7.35 (0.289)
0.3 (0.012)
6.8 (0.268)
SFH 4230
Empfohlenes Lotpaddesign Recommended Solder Pad Design
12.0 (0.472)
11.6 (0.457)
0.3 (0.012)
2.3 (0.091)
11.6 (0.457)
1.6 (0.063)
2.3 (0.091)
o4.0 (0.157) Heatsink attach 3 Lotstellen 3 solder points Thermisch optimiertes PCB Thermal enhanced PCB
o2.5 (0.098) o4.0 (0.157) 1.6 (0.063) Kupfer Copper
Lotstopplack Solder resist Lotpasten Schablone Solder paste stencil Bare Copper Freies Kupfer
10 (0.394)
Footprint
OHAY0681
Achtung: Anode und Heatsink sind elektrisch verbunden Attention: Anode and Heatsink are electrically connected
2007-03-29
7
SFH 4230
Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering
300 C 255 C 240 C 217 C 200 30 s max 150 120 s max 100 Ramp Up 3 K/s (max) 25 C 0 0 50 100 150 200 250 s 300 100 s max Ramp Down 6 K/s (max) 10 s min
Vorbehandlung nach JEDEC Level 4 Preconditioning acc. to JEDEC Level 4 (nach J-STD-020C) (acc. to J-STD-020C)
OHLA0687
T
250
Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile
C 260 C +0C -5 245 C 5 C C 235 C +5C -0
50
t
Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-03-29 8

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